HDI

Buried and blind via holes can be drilled.

• Minimum dielectric thickness 2 MIL.
• Laser drill : 1-2, 1-3
• Micro via copper fill and epoxy fill.
• Aspect ratio: 1:1-LASER via. 1:10- Buried via
• Line Space 3/3(Special requirement 2/2)
• Stacked Via
• Staggered via